Verizon engineer Chris Moore speaks with Tim Simpson, director of Penn State’s CIMP-3D lab at Innovation Park, as they test the recently installed 5G ultra-wideband capabilities. IMAGE: Kelby Hochreither/Penn State.
Penn State center gets 5G boost for digital connectivity research
2/17/2022
UNIVERSITY PARK, Pa. — The Penn State Center for Innovation Materials Processing through Direct Digital Deposition (CIMP-3D) at Innovation Park received a technological boost from Verizon this spring. The company enabled 5G ultra-wideband capabilities for the center in an effort to foster new research and development partnerships to improve commercial applications and workforce development through advanced wireless technologies. The technological upgrade will also help expand 3D printing access and education to Penn State students.
“We are excited to partner with Verizon to bring advanced digital connectivity to Penn State and enable new innovations in digital connectivity,” said Tim Simpson, the Paul Morrow Professor of Engineering Design and Manufacturing and co-director CIMP-3D. “Having 5G capabilities in CIMP-3D creates unique opportunities to drive the use and adoption of additive manufacturing as we embark on the fourth industrial revolution, or ‘Industry 4.0.’”
Read Verizon’s press release here.
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